Maintenance-Free Earthing Electrode
Copper-bonded chemical earthing electrodes with backfill compound for sub-1 ohm results.

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Request DatasheetOverview
Copper-bonded electrodes with a 250 micron molecularly bonded coating that does not peel the way plated pipe does, installed with a conductive backfill compound that holds moisture and lowers the resistance of the surrounding soil. Combined with the right electrode count and spacing, this reliably achieves the sub-1 ohm figure that transformer and panel earthing requires.
Technical specifications
| Electrode | 48 mm / 80 mm copper-bonded or GI pipe |
|---|---|
| Length | 2 m / 3 m |
| Copper bonding | 250 micron, molecularly bonded |
| Backfill | Conductive compound, 25 kg bags |
| Resistance | Under 1 ohm achievable with treatment |
| Standard | IS 3043 / IEC 62561-2 |
Specifications are indicative. Final ratings are confirmed against your site conditions and the approved make.
Applications
- Transformer neutral and body earthing
- Panel, motor and equipment earthing
- Lightning protection down-conductor earthing
- Solar plant and DC system earthing grids
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